Lidrotec

Lidrotec develops and manufactures laser dicing systems that use controlled liquids to cool workpieces and rinse debris during the microchip cutting process. The technology enables burr-free, high-precision wafer dicing for materials like silicon carbide (SiC) without the need for additional post-treatment or surface coatings. The company serves the semiconductor, medical, electronics, and material science industries with machines capable of full cuts, grooving, and structuring.